On Wednesday,
Samsung Electronics has announced its first High Bandwidth Memory (HBM) integrated with
artificial intelligence (AI) processing. Moreover, this is the world’s first memory which introduces CPU, GPU and RAM in a single chipset. The name of chipset introduced by
Samsung Electronics is HBM-PIM. As per Samsung Electronics, the single chipset will double up the system performance and reduce energy consumption by at least 70%.
Moreover, the HBM-PIM comes with powerful Artificial Intelligence computing capabilities inside a HBM-PIM. It accelerates large-scale processing in data centres, high-performance computing (HPC) systems, and AI-enabled Mobile applications.
Samsung has achieved to make power conditioning units working at 300 MHz, which works out to 1.2 TFLOPS processing power per chipset. As per Samsung Electronics, the power usage per chip has kept the same while carrying data at 2.4 Gigabits per second per pin. Reportedly, the overall system power consumption drops by 71%.
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